On December 16th, at the openEuler Summit 2023,HISILICON announces full support of  A² MCUs and MPUs for openEuler. HISILICON A² is HISILICON’s new solution for the home appliance, energy, industrial, and automotive sectors, which not only covers a series of RISC-V based MCUs but also includes high-performance ARM instruction set compatible MPUs and closely matched and compatible MPUs. HISILICON A² is a new solution for home appliances, energy, industry, automotive and other fields, which not only covers a series of RISC-V based MCUs, but also includes a high-performance MPU compatible with the ARM instruction set, and an operating system that is closely matched and optimised.

HISILICON’s A² represents the multiplication of two A’s to produce an exponential cumulative effect; one A (Application Specific) represents industry-specific, carrying HISILICON’s customer-centric philosophy of pursuing a close integration between chip design and customer application scenarios; the other A (Artificial The other A (Artificial Intelligence) represents the application of AI technology in MCU and embedded field.

For high-performance MPUs, HISILICON has successfully implemented a hybrid deployment of multi-OS framework based on openAMP (Open Asymmetric Multi-Processing), based on which customers can deploy multiple OS instances on one MPU chip at the same time; for example, the four main processors of Hesi’s MPUs are divided into two groups of 3+1, and through the dual-system architecture of openAMP, customers can deploy openEuler non-real-time system, which is required for eco-applications, on three of the CPU cores, while deploying UniProton real-time OS to the other core; in this way, customers can implement the original solution on one chip simultaneously. Through the dual-system architecture of openAMP, customers can deploy the openEuler non-real-time system that requires eco-applications on three of the CPU cores, and at the same time deploy the UniProton real-time operating system on the other core; in this way, customers can achieve the functions that can only be achieved by the two chips in the original scheme on a single chip, which on the one hand, helps customers simplify the system architecture, saves the cost, and at the same time, greatly improves the reliability of the system. On the one hand, it helps customers simplify system architecture and save costs, and at the same time greatly improves system reliability. HISILICON is the first chip manufacturer in the industry to support openEuler embedded homogeneous and heterogeneous multi-core hybrid deployment solutions.

In addition to the deep synergy with the operating system, the HISILICON A² solution also contains a large number of other black technologies, such as lightweight embedded AI with extremely low resource requirements that can be deployed on MCUs, high-level algorithms for industry applications, and RISC-V cores that can be customised with instruction sets for industry scenarios, etc. By exploring and innovating in these technological directions, the HISILICON A² solution has a unique differentiation in the field of MCUs and embedded MPUs. HISILICON A² solutions have unique differentiation advantages in the fields of MCU and embedded MPU.

At present, HISILICON A² MCU and MPU solutions have been deployed in multiple industry scenarios. For example, in the home appliance scenario, HISILICON’s MCU can achieve 16% energy saving in the air conditioning temperature adjustment stage. In industrial motion control scenarios, HISILICON’s MPU chip can achieve time jitter control within 1us under 125us motion cycle control, thus helping semiconductor, laser and other field scenarios achieve faster task processing and higher certainty.